Heterogeneous Integration Innovation Zone

Wednesday, September 18 10:00am

Outgrow to Next Era! Heterogeneous Integration Innovation Zone will present you the key approach and terminal application on HI technology, ASE and other industry players from 5G, IC design, packaging, and silicon photonic fields to showcase the latest trend and the possible future of AI Chips!

Venue : Booth #J3234, 1F, TaiNEX 1 



Company Content
ASE Inc. 2.5D, 3D, Fan-Out Packaging
Chunghwa Telecom Laboratories 5G Enabling Innovative Services
(1) High Speed SiPh Opto-electronics Measurement Platform
(2) Micro LED Chip Process and Mass Transfer Platforms
(3) 3DIC Heterogeneous Integration Process Platform
(4) Sub-THz System Laboratory
(1) Heterogeneous Integration Platform for AITA
(2) Advance AI Heterogeneous Integration Technology
MediaTek Inc. More than Moore: Heterogeneous Integration Technologies
Powertech Technology Inc. Panel Fan-Out & 3D IC Technology
Realtek Semiconductor Corp. Full Range of Connectivity Solutions
Siliconware Precision Industries Co., Ltd (SPIL)

Heterogeneous Integration for future Advanced Packaging Solution

SiPlus Co., Ltd.
(1) SiPlus Heterogeneous Integration platform - Integrated Substrate solutions
(2) eHDF Substrate
(3) Advance Hybrid Space Transformer
TechSearch Heterogeneous Integration Market Trend

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