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Technology Programs

Tuesday, September 17 9:00am

Date Time Event Location
September 17, 2019
(Tuesday)
09:00 – 17:00 SiP Global Summit 2019 – Heterogeneous Integration NOW & FUTURE – Day 1 – Advanced Packaging Technology Symposium Grand Ballroom, Grand Luxe Banquet, 3F, Building A, CTBC Financial Park
09:00 – 15:35 MEMS & Sensors Forum Room 504, 5F, TWTC Nangang Exhibition Hall
September 18, 2019
(Wednesday)
13:00 – 17:00 Smart Manufacturing Forum Room 401, 4F, TWTC Nangang Exhibition Hall
13:00 – 17:00 Sustainable Manufacturing Forum Room 402c, 4F, TWTC Nangang Exhibition Hall
September 19, 2019
(Thursday)
08:35 - 16:50 SiP Global Summit 2019 – Heterogeneous Integration NOW & FUTURE –
Day 2 – TBD
Grand Ballroom, Grand Luxe Banquet, 3F, Building A, CTBC Financial Park
08:50 – 16:20 Power Electronics and Optoelectronics Semiconductor Technology Forum Room 401, 4F, TWTC Nangang Exhibition Hall
09:00 – 16:35 Strategic Materials Conference Taiwan Booth #M1156, MASTER FORUM Stage, 4F, TWTC Nangang Exhibition Hall
09:00 – 17:30 High-Tech Facility International Forum Room 402abc, 4F, TWTC Nangang Exhibition Hall
September 20, 2019
(Friday)
08:55 – 16:25 IC Forum Room 401, 4F, TWTC Nangang Exhibition Hall
09:00 – 16:15 Advanced Semi Metrology Forum Room 504a, 5F, TWTC Nangang Exhibition Hall
09:50 – 16:10 Circular Economy Forum Room 504c, 5F, TWTC Nangang Exhibition Hall
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