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TechXPOT

TWTC Nangang Exhibition Hall Wednesday, September 18 11:00am

Advanced Materials Technology High-Tech Facility Innovative Technology & Product 

 

 Sept 18, 2019

TechXPOT 1F #K3276

Time Company Topic Language
12:20 -12:40  GrandiT Co., Ltd. Insights of Electronic Chemical Materials in China ZH
13:00 -13:20 Chongqing Qunwin Electronic Materials Co.,Ltd Nano Alloy: A New Material for High Power Semiconductor Devices Packaging ZH
13:20 -13:40 ANGUS CHEMICAL COMPANY ANGUS VOLTEN Offerings for Electronic Process ZH
13:40 - 14:00 NAMICS CORPORATION Copper foil surface treatment technology and low dielectric materials for high-speed transmission EN
14:00 - 14:20 Shanghang Zijin Jiabo Electronic New Material Technology Co.,Ltd. Study on alloy wire and copper wire ZH
14:20 - 14:40 Heraeus Materials Technology Taiwan Ltd. Secure Your Key To Future Power Electronics ZH
14:40 - 15:00 Evertech Enterprise Co., Ltd. Introduction of "Evertech" and the products ZH
15:00 - 15:20 Arkema (China) Investment Co., Ltd. ARKEMA KYNAR® PVDF For High Purity Industry ZH
15:20 - 15:40 Henan Guoxi Ultrapure New Materials Co.,ltd Applications of Ultra High Purity Metals in Semiconductor Field ZH
15:40 - 16:00 5N Plus Inc., Micro Powders Ultra-Fine Metal Powders for a Wide Range of Microelectronic Assemblies EN

 

TechXPOT 4F #L1216

Time Company Topic Language
10:40 - 11:00 Schneider Electric Taiwan Co., Ltd. Presentation by Schneider Electric Taiwan Co., Ltd.  
11:00 - 11:20 JUSUN INSTRUMENTS CO. LTD. The Innovation Technology for AMC/Ambient & Stack Gases compositions and PM2.5 ZH
11:20 - 11:40 New Fast Technology Co.,Ltd.  Intelligent On-line AMC Monitoring Technical Conclude in Fab ZH
11:40 - 12:00 TECHGO INDUSTRIAL CO., LTD. The Reserch and Design of Modular Structure for Cooling Tower ZH
12:00 - 12:20 SEMI Taiwan High-Tech Facility Committee NTUT-A total solution of contamination control for wafers in a FOUP when FOUP door is in open condition. ZH、EN
13:20 - 13:40 Vertiv Taiwan Co. Ltd. HIGH EFFICIENCY MODES OF OPERATION--Path toward highest energy efficiency without load availability trade-off ZH
13:40 - 14:00 Greenfiltec Ltd. Evolution and the future of chemical filter in MAU ZH
14:00 - 14:20 Wholetech System Hitech Limited Dust control technology for Process exhaust gas ZH
14:40 - 15:00 GEMUE Taiwan Ltd. WHAT DO SKYSCRAPERS AND MICROCHIPS HAVE IN COMMON? FOCUS ON THE SEMICONDUCTOR INDUSTRY. ZH
15:00 - 15:20 Trusval Technology Co., Ltd. Moving Towards Sustainable Manufacturing: Trusval Solutions and the Upcoming Trend in Semiconductor Field ZH
15:20 - 15:40 ECI Technology Inc Next generation Chemical process control in Semiconductor Industry EN
15:40 - 16:00 YeSiang Enterprise Co., Ltd. The Best AMC Solution in PostMoore Law Era ZH
16:00 - 16:20 JACOBI CARBONS AG Semiconductor Gas Filtration Challenge EN

 

 

 

 Sept 19, 2019

TechXPOT 1F #K3276

Time Company Topic Language
10:30 - 12:00 Instrument Technology Research Center NARLabs 2019 ASEPT Seminar ZH
13:30 - 14:00 CONNECTEC JAPAN Presentation by CONNECTEC JAPAN  
15:00 - 15:30 Manz Taiwan Ltd. Manz's Solution in FOPLP RDL Formation ZH
11:10 - 11:30 Indium Corporation The Challenge and Solution on Flip-chip and BGA Ball Mount Process ZH

 

TechXPOT 4F #L1216

Time Company Topic Language
10:30 - 11:00 SGS Taiwan Ltd. New Development on Qualification and Reliability Assessment of Microelectronic Products for Chemicals of the Semiconductor Process and Automotive Applications EN
11:00 - 11:30 3S Silicon Tech., Inc. Residue Free & Low Void — Formic Acid Vacuum Reflow Oven EN
11:30 - 12:00 SilcoTek Corporation CVD Coatings to Control Metal-Ion and Particulate Contamination EN
13:30 - 14:00 INTEKPLUS CO., LTD. TAIWAN BRANCH Presentation by INTEKPLUS CO., LTD. TAIWAN BRANCH  
14:00 - 14:30 EVG-JOINTECH CORP. SmartNIL™ Nanoimprint Lithography enabling advanced functionality of optical devices for AR EN

 

 

 Sept 20, 2019

TechXPOT 1F #K3276

Time Company Topic Language
10:20 - 10:50 Nanoelectronics Research Institute, National Institute of Advanced Industrial Science and Technology (AIST) Packaging in Minimal Fab EN
10:50 - 11:10 NIHON SUPERIOR (Taiwan) Co., LTD Low temperature sintering Nano Silver and SN100C Solder total solution ZH
11:10 - 11:40 PBI advanced materials Co.,Ltd. Ultra high heat resistance materials ZH
13:30 - 13: Daxin Materials Corp. Multi-functional TBDB Material Solutions for Advanced Packaging Technologies ZH
13:50 - 14:10 Yuhon Enterprise Corporation The application of Conductive Paste EN

 

TechXPOT 4F #L1216

Time Company Topic Language
10:20 - 10:40 SEMI Taiwan High-Tech Facility Committee MOST Sponsored R&D on Mitigating Magnetic Interference for High-Tech Fab Facilities. ZH
11:20 - 11:40 RAYZHER Industrial CO., LTD High-tech Fab & facility Planning and Design ZH
11:40 - 12:00 Joy Allied Technology Inc. The Pre-stage equipment for analysis of heavy metals on wafer surfaces and chemicals bath. A new patent invention with safe and fast equipment has zero background. The PDT system easily can transfer all kinds of acids or base to meters or few hundred meters within a minute. The samples will directly go to ICP MS. ZH

 

 

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